Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-09-21
2000-05-09
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 522, 257675, H01R 4300
Patent
active
060586028
ABSTRACT:
A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.
REFERENCES:
patent: 5122858 (1992-06-01), Mahulikar et al.
patent: 5205288 (1993-04-01), Doering et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5378924 (1995-01-01), Liang
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5905299 (1999-05-01), Lacap
patent: 5942234 (1995-08-01), Liang
Davidson, H.L et al Proc. 45th Electronic Components and Tech. Conf. pp. 538-41, 1995.
Burgess et al ISHM '92 Proc. of the '92 Intr. Symposium on Microelectronics pp. 106-111, 1992.
Petkie et al, Proc. 4th Intr Symposium of Advanced Packaging Materials Process, Properties and Interfaces, 1998.
Arbes Carl J.
Boys Donald R.
Integrated Packaging Assembly Corporation
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