Method for embodying twin-connection integrated circuits

Details Method for embodying twin-connection integrated circuits Method for embodying twin-connection integrated circuits

1991-10-03

1993-07-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 437195, B44C 122, C03C 1500, C03C 2506

Patent

active

052289516

ABSTRACT:
A method is disclosed for a forming integrated circuit on a semiconductor chip, said semiconductor chip having the first surface having a central region and a peripheral region including forming more than one contact region on each line connecting two active regions of the semiconductor chip.

REFERENCES:
patent: 4860087 (1989-08-01), Matsubara
"Alternative Bonding Methods for Chip-on-Board Technology", 36th Electronic omponents Conference, ITT Technology Division, Richard Landis, May 5-7, 1986, pp. 53-58.

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