Method for embedding a component in a base and forming a...

Details Method for embedding a component in a base and forming a... Method for embedding a component in a base and forming a...

2006-01-31

2006-01-31

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000, C438S106000

Reexamination Certificate

active

06991966

ABSTRACT:
The invention includes a method, in which at least some of the semiconductor components forming part of an electronic circuit are embedded in a base, such as a circuit board, during the manufacture of the base. Thus, the base structure is basically manufactured around the semiconductor component. According to the invention, at least one conductive pattern and through holes for the semiconductor components are made in the base. Thereafter, the semiconductor components are placed in the holes in alignment with the conductive pattern. The semiconductor components are attached to the structure of the base, and one or more conductive pattern layers are made in the base in such a way that at least one conductive pattern forms an electrical contact with the contact areas of the surface of the semiconductor component.

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