Method for electroplating a conductive layer on a substrate

Details Method for electroplating a conductive layer on a substrate Method for electroplating a conductive layer on a substrate

1996-02-06

1998-07-07

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430330, 427 58, 427256, G03F 700

Patent

active

057766630

ABSTRACT:
A method for forming a conductive layer on a substrate having a patterned seed layer thereon includes the steps of: (a) depositing a polyimide layer on the patterned seed layer and a part of the substrate which is not covered with the patterned seed layer; (b) directing a light beam onto a portion of the polyimide layer formed on top of the patterned seed layer; (c) developing the portion of the polyimide layer, thereby exposing the patterned seed layer; (d) curing the remaining portion of the polyimide layer at an appropriate condition, thereby turning it into an insulator; and (e) electroplating the conductive layer on the exposed patterned seed layer.

REFERENCES:
patent: 5209817 (1993-05-01), Ahmad
patent: 5529863 (1996-06-01), Swirbel

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