Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-01-03
2008-09-30
Kik, Phallaka (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C700S098000, C700S119000, C700S121000, C430S005000, C378S035000, C438S607000, C438S669000, C438S761000
Reexamination Certificate
active
07430731
ABSTRACT:
Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.
REFERENCES:
patent: 5137662 (1992-08-01), Hull et al.
patent: 5182055 (1993-01-01), Allison et al.
patent: 5184306 (1993-02-01), Erdman et al.
patent: 5190637 (1993-03-01), Guckel
patent: 5216616 (1993-06-01), Masters
patent: 5321622 (1994-06-01), Snead et al.
patent: 5430666 (1995-07-01), DeAngelis et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6029096 (2000-02-01), Manners et al.
patent: 6084980 (2000-07-01), Nguyen et al.
patent: 6333741 (2001-12-01), Snead et al.
patent: 6366825 (2002-04-01), Smalley et al.
patent: 6600965 (2003-07-01), Hull et al.
patent: 2002/0093115 (2002-07-01), Jang et al.
patent: 2002/0149137 (2002-10-01), Jang et al.
patent: 2003/0027363 (2003-02-01), Kodama
patent: 2003/0215664 (2003-11-01), Morales et al.
patent: 2004/0140862 (2004-07-01), Brown et al.
patent: 2004/0251581 (2004-12-01), Jang et al.
patent: 2005/0202665 (2005-09-01), Namba et al.
patent: 2005/0221529 (2005-10-01), Bang et al.
patent: 2006/0084265 (2006-04-01), Cohen et al.
patent: 2007/0111498 (2007-05-01), Nambo et al.
Cohen, et al., “EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features”, Proc. 9th Solid Freeform Fabrication, The University of Texas at Austin, Aug. 1998, pp. 161-168.
Adam L. Cohen, et al., “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMS”, Proc. 12th IEEE Micro Electro Mechanical Systems Workshop, IEEE, Jan. 17-21, 1999, pp. 244-251.
“Microfabrication—Rapid Prototyping's Killer Application”, Rapid Prototyping Report, CAD/CAM Publishing, Inc., Jun. 1999, pp. 1-5.
Adam L. Cohen, “3-D Micromachining by Electrochemical Fabrication”, Micromachine Devices, Mar. 1999, pp. 6-7.
Gang Zhang, et al., “EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures”, Proc. 2nd International Conference on Integrated MicroNanotechnology for Space Applications, The Aerospace Co., Apr. 1999, 11 pages.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, 3rd International Workshop on High Aspect Ratio Microstructure Technology (HARMST'99), Jun. 1999, 4 pages.
Adam L. Cohen, et al., “EFAB: Low-Cost, Automated Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures”, Micromachining and Microfabrication Process Technology, SPIE 1999 Symposium on Micromachining and Microfabrication, Sep. 1999, 11 pages.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, Nov. 1999, pp. 55-60.
Adam L. Cohen, “Electrochemical Fabrication (EFABTM)”, Chapter 19 of the MEMS Handbook, edited by Mohamed Gad-El-Hak, CRC Press, 2002, pp. 19/1-19/23.
Cohen Adam L.
Thompson Jeffrey A.
Kik Phallaka
Smalley Dennis R.
University of Southern California
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