Method for efficiently producing removable peripheral cards

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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C438S112000, C438S460000

Reexamination Certificate

active

07094633

ABSTRACT:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

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