Etching a substrate: processes – Etching of semiconductor material to produce an article...
Patent
1996-02-14
1997-12-23
Breneman, R. Robert
Etching a substrate: processes
Etching of semiconductor material to produce an article...
216 90, 438747, 23294R, H01L 21306, B01D 700, B01D 1200
Patent
active
057003793
ABSTRACT:
A micromechanical structure is etched on a component that has been introduced into a container having a plurality of inlet and discharge openings. The liquid etchant is displaced downwardly through a liquid discharge at the underside of the container by admitting water through the liquid inlet at the upper side, whereby no turbulence occurs in the liquid flow. The water employed as a rinsing agent is displaced by a liquid having a lower density such as, for example, ethanol or acetone. Finally, a liquefied gas, for example liquid carbon dioxide, is admitted via the liquid, this gas is evaporated by heating the container above the critical temperature, the pressure in the inside of the container is reduced to the ambient air pressure by opening a gas discharge, and the component is removed from the container through a sluice or lock.
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Canham, L. T. et al., "Luminescent Anodized Silicon Aerocrystal Networks Prepared by Supercritical Drying," Letters to Nature, v. 368, pp. 133-135, Mar. 10, 1994.
Legtenberg, R. et al., "Stiction of Surface Micromachined Structures after Rinsing and Drying: Model and Investigation of Adhesion Mechanisms," Sensors and Actuators A, 43, pp. 230-238, 1994.
Photoresist-Assisted Release of Movable Microstructures--Kim et al Jpn. J. Appl. Phys., vol. 32 (1993) pp. L1642-L1644.
Stiction of surface micromachined structures after rinsing and drying: model and investigation of adhesion mechanisms--Sensors and Actuators A. 43 (1994) 230-238.
Letters to Nature--vol. 368 10 Mar. 1994.
Thin Solid Films 255 (1995) 115-118.
Adjodha Michael E.
Breneman R. Robert
Siemens Aktiengesellschaft
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