Method for dividing a semiconductor substrate and a method...

Details Method for dividing a semiconductor substrate and a method... Method for dividing a semiconductor substrate and a method...

2011-01-11

2011-01-11

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C257SE21237

Reexamination Certificate

active

07867879

ABSTRACT:
A method for dividing a semiconductor substrate involves providing a semiconductor substrate. At least one separating trench is produced at a front side of the semiconductor substrate. A layer is produced at least at the bottom of the at least one separating trench. The semiconductor substrate is thinned at a rear side of the semiconductor substrate at least as far as the layer at the bottom of the at least one separating trench. The layer is severed in order to divide the semiconductor substrate into individual pieces.

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