Method for direct attachment of an on-chip bypass capacitor in a

Details Method for direct attachment of an on-chip bypass capacitor in a Method for direct attachment of an on-chip bypass capacitor in a

1995-06-05

1997-05-13

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438620, 438119, 438641, H01L 2160

Patent

active

056292406

ABSTRACT:
Switching noise at integrated circuit V.sub.DD and V.sub.SS metal traces is reduced by minimizing lead inductance in on-chip bypass capacitors. For each on-chip bypass capacitor, a pair of V.sub.DD -carrying and V.sub.SS -carrying metal traces is formed, these traces having regions spaced-apart laterally a distance .DELTA.X corresponding to lateral separation of the bypass capacitor connecting pads. For each bypass capacitor, column-shaped openings, spaced-apart distance .DELTA.X, are formed through the passivation and inter-metal oxide layers, as needed. These openings expose and access regions of the pair of spaced-apart metal traces carrying V.sub.SS and V.sub.DD. These openings, which may be formed after the IC has been fabricated, preferably are formed using focussed ion beam technology ("FIB"). Alternatively, these openings may be formed using masking and etching steps. The column-shaped openings are then made into conductive columnar elements, preferably using FIB deposition of tungsten or platinum. Conductive element pads are formed atop the conductive columnar elements at the outer surface of the IC passivation layer. The bypass capacitors are then attached to the IC, and the capacitor connecting pads are electrically connected to the respective conductive element pads using conductive epoxy or solder. This direct attachment of the on-chip bypass capacitors reduces effective capacitance lead inductance and improves attenuation of on-chip switching noise.

REFERENCES:
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 5010445 (1991-04-01), Weinold
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5115298 (1992-05-01), Loh
patent: 5258329 (1993-11-01), Shibata
patent: 5306952 (1994-04-01), Matsuura et al.
patent: 5457062 (1995-10-01), Keller et al.
Hashemi, et al., "The Close Attached Capacitor: A Solution to Switching Noise Problems." IEEE Publication 0148-6411/92$03.00, pp. 1056-1063 (1992) IEEE Log 9203458.

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