Method for differential selective deposition of metal for fabric

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29571, 29591, 134 1, 156646, 156656, 156664, 156345, 20419235, 204298, 427 88, 427 89, 427 91, C23F 102, B44C 122, C03C 1500, C03C 2506

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046170871

ABSTRACT:
A deposition technique for forming metal regions on semiconductor substrates, and more particularly to a fabrication method for the differential selective deposition of tungsten for forming tungsten contacts on an integrated circuit chip.
Tungsten hexafluoride gas (WF6) is introduced into a deposition chamber containing a silicon substrate with an apertured silicon dioxide mask layer thereon. The exposed Si surfaces on which the selective deposition is to be performed, are first converted to W surfaces by the substitution reaction:

REFERENCES:
patent: 3785862 (1974-01-01), Grill
patent: 4349408 (1982-09-01), Tang et al.

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