Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-09-27
1986-10-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29571, 29591, 134 1, 156646, 156656, 156664, 156345, 20419235, 204298, 427 88, 427 89, 427 91, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
046170871
ABSTRACT:
A deposition technique for forming metal regions on semiconductor substrates, and more particularly to a fabrication method for the differential selective deposition of tungsten for forming tungsten contacts on an integrated circuit chip.
Tungsten hexafluoride gas (WF6) is introduced into a deposition chamber containing a silicon substrate with an apertured silicon dioxide mask layer thereon. The exposed Si surfaces on which the selective deposition is to be performed, are first converted to W surfaces by the substitution reaction:
REFERENCES:
patent: 3785862 (1974-01-01), Grill
patent: 4349408 (1982-09-01), Tang et al.
Iyer Subramanian S.
Joshi Rajiv V.
Goodwin John J.
International Business Machines - Corporation
Powell William A.
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