Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-02-27
2007-02-27
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S458000, C438S460000, C438S462000
Reexamination Certificate
active
10725697
ABSTRACT:
A method is disclosed for dicing a wafer having a base material with a diamond structure. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The wafer is then diced through at least one line along a direction at a predetermined offset angle from a natural cleavage direction of the diamond structure.
REFERENCES:
patent: 362105446 (1987-05-01), None
Hu Chenming
Huang Chien-Chao
Lee Hsin-Hui
Wang Chao-Hsiung
Yang Fu-Liang
Duane Morris LLP
Taiwan Semiconductor Manufacturing Company
Thomas Toniae M.
Wilczewski M.
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