Method for detecting the end point by using matrix

Details Method for detecting the end point by using matrix Method for detecting the end point by using matrix

2006-02-21

2006-02-21

Stafira, Michael P. (Department: 2877)

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

C216S060000, C438S710000

Reexamination Certificate

active

07001530

ABSTRACT:
A method for detecting the end point of plasma etching process by using matrix comprises a step of detecting a beginning matrix including emitting intensities and/or other plasma parameters of at least two different plasma species during beginning etching process. Then, a step of detecting an etching matrix is performed in which the etching matrix includes emitting intensities and/or other plasma parameters of the at least two different plasma species at the etching reaction. An end point matrix is then computed by using the beginning as well as etching matrices and compared to a reference end point matrix to decide whether the end point is reached.

REFERENCES:
patent: 5121337 (1992-06-01), Brown
patent: 5288367 (1994-02-01), Angell et al.
patent: 5479340 (1995-12-01), Fox et al.
patent: 5862060 (1999-01-01), Murray, Jr.
patent: 6153115 (2000-11-01), Le et al.
patent: 6238937 (2001-05-01), Toprac et al.
patent: 2005/0016947 (2005-01-01), Fatke et al.

Affiliated with

Also associated with

Rating

Method for detecting the end point by using matrix does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for detecting the end point by using matrix, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for detecting the end point by using matrix will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3669290