Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1998-11-06
2000-10-24
McDonald, Rodney
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419217, 20419225, 20429809, 20429815, 438584, C23C 1434
Patent
active
061361593
ABSTRACT:
A method of depositing aluminum or other metals so that vias are more completely filled is disclosed. The wafer or substrate is preheated to a temperature of approximately 200.degree. C. Then the wafer is placed in an ambient of approximately 350.degree. C. while metal deposition commences. The resulting metal layer has a gradually increasing grain size and exhibits improved via filling. Also disclosed is a method and apparatus (involving cooling of support structures) for deposition of an antireflective coating to prevent rainbowing or spiking of the coating into the underlying metal.
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Buckfeller Joseph William
Chittipeddi Sailesh
Merchant Sailesh Mansinh
Grillo Anthony
Lucent Technologies - Inc.
McDonald Rodney
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