Method for depositing metal

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20419217, 20419225, 20429809, 20429815, 438584, C23C 1434

Patent

active

061361593

ABSTRACT:
A method of depositing aluminum or other metals so that vias are more completely filled is disclosed. The wafer or substrate is preheated to a temperature of approximately 200.degree. C. Then the wafer is placed in an ambient of approximately 350.degree. C. while metal deposition commences. The resulting metal layer has a gradually increasing grain size and exhibits improved via filling. Also disclosed is a method and apparatus (involving cooling of support structures) for deposition of an antireflective coating to prevent rainbowing or spiking of the coating into the underlying metal.

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