Method for depositing magnetic film on both substrate surfaces a

Details Method for depositing magnetic film on both substrate surfaces a Method for depositing magnetic film on both substrate surfaces a

1996-11-13

1998-06-09

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419213, 20419215, 20429803, 20429819, 20429822, 20429826, C23C 1434

Patent

active

057627665

ABSTRACT:
A sputtering method includes depositing a magnetic thin film on both surfaces of a substrate by magnetron sputtering, wherein magnetic assemblies of magnetron cathodes form a magnetic field asymmetric to a rotation axis perpendicular to the substrate on a target, and a pair of magnet assemblies of magnetron cathodes opposing each other rotate at the same speed and in the same direction. A sputtering mechanism for depositing a magnetic thin film on both surfaces of the substrate by magnetron sputtering, includes a controller system for controlling a rotation drive unit of each magnet assembly on a pair of magnetron cathodes being held in common.

REFERENCES:
patent: 4880514 (1989-11-01), Scott et al.
patent: 4894133 (1990-01-01), Hedgcoth
patent: 5047130 (1991-09-01), Akao et al.
Anelva Disk Sputtering System C-3010 (Brochure); Aug. 1995.
Anelva In-Line Disk Sputtering System 3100 Series; (Brochure); May 1989.

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