Method for depositing conductive metal traces on diamond

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156650, 156901, 156651, B44C 122, C23F 100

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active

053363680

ABSTRACT:
Adherent traces of a carbide-forming conductive metal are produced on a diamond surface, without deposition of carbide in areas to be non-conductive, by depositing an undercoat layer of a non-carbide-forming metal such as palladium, patterning said undercoat layer and then depositing a bond layer of the carbide-forming metal. The undercoat layer and the portion of the bond layer deposited thereon are then removed, typically by etching.

REFERENCES:
patent: 5034784 (1991-07-01), Yamazaki
patent: 5107315 (1992-04-01), Kumagai et al.
patent: 5250149 (1993-10-01), Kimoto et al.

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