Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-07-08
1994-08-09
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156650, 156901, 156651, B44C 122, C23F 100
Patent
active
053363680
ABSTRACT:
Adherent traces of a carbide-forming conductive metal are produced on a diamond surface, without deposition of carbide in areas to be non-conductive, by depositing an undercoat layer of a non-carbide-forming metal such as palladium, patterning said undercoat layer and then depositing a bond layer of the carbide-forming metal. The undercoat layer and the portion of the bond layer deposited thereon are then removed, typically by etching.
REFERENCES:
patent: 5034784 (1991-07-01), Yamazaki
patent: 5107315 (1992-04-01), Kumagai et al.
patent: 5250149 (1993-10-01), Kimoto et al.
Iacovangelo Charles D.
Jerabek Elihu C.
Williams Bradley E.
General Electric Company
Pittman William H.
Powell William
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