Method for densifying leadframe conductor spacing

Details Method for densifying leadframe conductor spacing Method for densifying leadframe conductor spacing

1986-05-08

1987-12-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29827, 156634, 156656, 1566611, 156901, 357 70, 357 72, 361421, 439 72, C23F 102, B44C 122

Patent

active

047117001

ABSTRACT:
A leadframe assembly comprises a plurality of bifurcated leads, each characterized by an inner lead end region adapted for connection to the die bond pads and an outer lead end region adapted for connection to external circuitry.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3795044 (1974-03-01), Peltz

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