Method for defect reduction

Details Method for defect reduction Method for defect reduction

2005-07-19

2005-07-19

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S054000

Reexamination Certificate

active

06918819

ABSTRACT:
A method of removing at least one particle from a substrate is disclosed comprising polishing a metallized layer over the substrate using a slurry to remove a portion of the metallized layer and polishing the substrate using the slurry to remove a portion of a barrier between the metallized layer and the substrate. The method further includes introducing deionized water onto the substrate and introducing a solution comprising a weak acid selected from the group consisting of acetic acid, citric acid, gluconic acid, glucuronic acid, oxalic acid, and tartaric acid.

REFERENCES:
patent: 3879216 (1975-04-01), Austin
patent: 4541945 (1985-09-01), Anderson et al.
patent: 4755230 (1988-07-01), Ashton et al.
patent: 5633068 (1997-05-01), Ryoke et al.
patent: 5639722 (1997-06-01), Kong et al.
patent: 5709588 (1998-01-01), Muroyama
patent: 5817569 (1998-10-01), Brenner et al.
patent: 5896875 (1999-04-01), Yoneda
patent: 5972124 (1999-10-01), Sethuraman et al.
patent: 5989353 (1999-11-01), Skee et al.
patent: 6022400 (2000-02-01), Izumi et al.
patent: 6169034 (2001-01-01), Avanzino et al.
patent: 6178585 (2001-01-01), Cadien et al.
patent: 6190237 (2001-02-01), Huynh et al.
patent: 6217416 (2001-04-01), Kaufman et al.

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