Method for cutting solid-state image pickup device

Details Method for cutting solid-state image pickup device Method for cutting solid-state image pickup device

2006-09-19

2010-02-09

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21002, C257SE21599

Reexamination Certificate

active

07659147

ABSTRACT:
In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.

REFERENCES:
patent: 2003/0123779 (2003-07-01), Hashimoto
patent: 2004/0189855 (2004-09-01), Takasaki et al.
patent: 2009/0046183 (2009-02-01), Nishida et al.
patent: 1 463 120 (2004-09-01), None
patent: 2003-197885 (2003-07-01), None
patent: 2004-6834 (2004-01-01), None
patent: 2004-63782 (2004-02-01), None
patent: 2004-312666 (2004-11-01), None

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