Method for cutting an LCD substrate using coolant having low...

Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...

Reexamination Certificate

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Details

C065S112000, C219S121670, C219S121720

Reexamination Certificate

active

07542125

ABSTRACT:
Disclosed is a method of cutting a liquid crystal display (LCD) unit cell from an LCD assembly panel. The method includes applying a coolant onto heated cutting path formed on the LCD assembly panel. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

REFERENCES:
patent: 3453097 (1969-07-01), Hafner
patent: 5622540 (1997-04-01), Stevens
patent: 6489588 (2002-12-01), Hoekstra et al.
patent: 6822725 (2004-11-01), Choo et al.

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