Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1997-01-23
2000-04-11
Wilczewski, M
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438486, 438487, H01L 2100, H01L 2184
Patent
active
060487585
ABSTRACT:
A little amount of nickel is introduced into an amorphous silicon film formed on a glass substrate to crystallize the amorphous silicon film by heating. In this situation, nickel elements remain in a crystallized silicon film. An amorphous silicon film is formed on the surface of the crystallized silicon film and then subjected to a heat treatment. With this heat treatment, the nickel elements are diffused in the amorphous silicon film, thereby being capable of lowering the concentration of nickel in the crystallized silicon film.
REFERENCES:
patent: 5543636 (1996-08-01), Yamazaki
patent: 5707882 (1998-01-01), Hamada et al.
patent: 5759879 (1998-06-01), Iwasaki
patent: 5789284 (1998-08-01), Yamazaki et al.
patent: 5797999 (1998-08-01), Sannomiya et al.
patent: 5837569 (1998-11-01), Makita et al.
patent: 5859443 (1999-01-01), Yamazaki et al.
Miyanaga Akiharu
Ohtani Hisashi
Teramoto Satoshi
Yamazaki Shunpei
Semiconductor Energy Laboratory Co,. Ltd.
Wilczewski M
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