Method for creating a hermetic seal and package made thereby

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating

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438118, 438106, H01L 2144, H01L 2148, H01L 2150

Patent

active

061534498

ABSTRACT:
A method for creating hermetic seals in semiconductor packages is provided. The method includes the applying a sealing glass to ceramic layers and placing a ceramic tape layer there between. The assemblage is then laminated and fired, or sintered, to marry the material layers together to form a hermetic seal. The hermetic seal made thereby may be incorporated into a wide variety of semiconductor devices including packages and feedthroughs.

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patent: 5285570 (1994-02-01), Fulinara
patent: 5475567 (1995-12-01), Hearn
Strat-E-Film Fine Line Metalization, 1994, StratEdge Corporation.
Low Cost Ceramic Packages for mm-Wave GaAs Ics; StratEdge Corp.; 1994 Horizon House Publications, Inc. (2 pgs.).
A Multilayer Hybrid Substrate; 1994 StratEdge Corporation.
Ceramic Filter Technology; 1994 StratEdge Corporation.
Planar Feedthrough Technology; 1994 StratEdge Corporation.
Model Number SE20-103 DC-20 GHz Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SE20-200 DC-20 GHz Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SE20-300 DC-20 GHz Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580234 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580237 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580236 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580231 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580230 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580235 Ceramic Microwave Package; 1994 StratEdge Corporation.
Model Number SEC-580180 Ceramic Microwave Package; 1994 StratEdge Corporation.
StratEdge Corporation Application Notes; 1994 StratEdge Corporation.

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