Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1998-04-24
2000-11-28
Tran, Andrew
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438118, 438106, H01L 2144, H01L 2148, H01L 2150
Patent
active
061534498
ABSTRACT:
A method for creating hermetic seals in semiconductor packages is provided. The method includes the applying a sealing glass to ceramic layers and placing a ceramic tape layer there between. The assemblage is then laminated and fired, or sintered, to marry the material layers together to form a hermetic seal. The hermetic seal made thereby may be incorporated into a wide variety of semiconductor devices including packages and feedthroughs.
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Occhipinti Joseph S.
Steddom Clark M.
Yglesia Larry G.
Brush Wellman Inc.
Pejic Nenad
Smith Bradley K.
Tran Andrew
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