Method for correcting optical proximity effect

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Details

C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C430S005000, C430S030000

Reexamination Certificate

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07827520

ABSTRACT:
A method of correcting an optical proximity effect may include the steps of: fabricating a test mask having test patterns; projecting patterns on a wafer using the test mask; measuring line widths of the patterns formed on the wafer; and executing a model calibration using the measured line widths and writing a correction recipe. The entire area of the wafer chip may be divided into a plurality of templates. An optical proximity correction may be executed on one of the templates and it may be verified that the optical proximity correction was executed properly on another template. The data for the templates that pass a verification may be merged and final data may be written using the merged data. A photomask may be fabricated using the final data.

REFERENCES:
patent: 6928636 (2005-08-01), Ohnuma
patent: 6996797 (2006-02-01), Liebmann et al.
patent: 7010775 (2006-03-01), Ohmori
patent: 7213226 (2007-05-01), Kotani et al.
patent: 7438996 (2008-10-01), Ozawa
patent: 2003/0192015 (2003-10-01), Liu
patent: 10-2003-0007951 (2003-01-01), None
patent: 10-2003-0060747 (2003-07-01), None
patent: 10-2005-0078225 (2005-08-01), None
patent: 10-2005-0099457 (2005-10-01), None

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