Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2006-12-05
2006-12-05
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S784000
Reexamination Certificate
active
07144824
ABSTRACT:
A method for controlling the properties of a dielectric anti-reflective coating (DARC) is provided. In the process of forming the DARC, a nitrogen-containing gas is added to a reaction gas comprising silicon-containing gas and oxygen for controlling the n value of the DARC. Furthermore, the proportion of the silicon-containing gas to the oxygen or the proportion of the silicon-containing gas to the nitrogen-containing gas is increased to control the k value of the DARC. By means of proper control of the n value and the k value, the DARC can have the lowest substrate reflectivity.
REFERENCES:
patent: 6218314 (2001-04-01), Lin
patent: 6566186 (2003-05-01), Allman et al.
patent: 6924191 (2005-08-01), Liu et al.
Lu Chien-Hung
Luo Shing-Ann
Su Chin-Ta
Dang Phuc T.
J.C. Patents
Macronix International Co. Ltd.
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