Metal fusion bonding – Process – Preplacing solid filler
Patent
1996-03-29
1997-08-26
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
228254, 22818022, H05K 334
Patent
active
056603215
ABSTRACT:
An method for depositing solder onto the pad-on and pad-off via contacts of a substrate is disclosed. In one embodiment the present invention includes positioning a mask having a first opening of a first diameter and a second opening of a second diameter over a substrate having both pad-on and pad-off via contacts. The substrate is positioned over the substrate such that the first opening is positioned over the pad-on via contact and the second opening is positioned over the pad-off via contact. Solder of a first volume and solder of a second volume are deposited onto the pad-on and pad-off via contacts, respectively, by forcing a solder paste through the mask openings. In this manner, solder bumps having a uniform height and volume above the pad-on via contact plane is established after reflowing the deposited solder.
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Ichikawa Kinya
Ishida Kenzo
Mashimoto Yohko
Heinrich Samuel M.
Intel Corporation
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