Method for controlling pH during planarization and cleaning...

Details Method for controlling pH during planarization and cleaning... Method for controlling pH during planarization and cleaning...

2007-05-08

2007-05-08

Wilson, Lee D. (Department: 3723)

Abrading

Machine

Rotary tool

C451S056000, C451S041000, C438S692000

Reexamination Certificate

active

11149972

ABSTRACT:
A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.

REFERENCES:
patent: 3638366 (1972-02-01), Gamache
patent: 3841031 (1974-10-01), Walsh
patent: 3957553 (1976-05-01), Smith
patent: 4638553 (1987-01-01), Nilarp
patent: 4879258 (1989-11-01), Fisher
patent: 4903440 (1990-02-01), Kirk et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4954141 (1990-09-01), Takiyama et al.

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