Method for contaminant removal

Details Method for contaminant removal Method for contaminant removal

2006-04-20

2009-11-24

Chea, Thorl (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making named article

C430S311000, C430S321000, C430S330000, C216S024000, C134S001300

Reexamination Certificate

active

07622244

ABSTRACT:
Method for removing contaminants from a surface during semiconductor fabrication. A preferred embodiment comprises developing a resist layer on a top surface of a semiconductor substrate, curing the developed resist layer, and cleaning the developed resist layer with a developer solution to remove contaminants. The cleaning makes use of the same developer solution used to develop the resist layer, so the cleaning makes use of a process that already exists and requires no additional investment to implement, while the curing stabilizes the developed resist layer so that the cleaning does not damage the developed resist layer.

REFERENCES:
patent: 5567334 (1996-10-01), Baker et al.
patent: 6383723 (2002-05-01), Iyer et al.
patent: 2002/0144707 (2002-10-01), Chiu
patent: 2005/0233921 (2005-10-01), Lee et al.

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