Method for connecting leadless chip package

Details Method for connecting leadless chip package Method for connecting leadless chip package

1988-03-23

1989-08-29

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29832, B23P 1102

Patent

active

048604437

ABSTRACT:
Leadless chip package is adhesively secured to printed wiring board and is electrically connected by metallic conductor ribbon or wire to pads on the package and pads on the printed wiring board to provide secure connected without risk of solder bridging on high density leadless chip packages.

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Fehr, Geral K., Microcircuit Packages and Assembly Techniques, Insulation/Circuits, Nov. 1971, pp. 16 to 20.

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