Method of assembling a fluid-cooled integrated circuit package

Details Method of assembling a fluid-cooled integrated circuit package Method of assembling a fluid-cooled integrated circuit package

1988-03-31

1989-08-29

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

2940203, 228187, 357 74, 357 81, H05K 334

Patent

active

048604445

ABSTRACT:
A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips.

REFERENCES:
patent: 4233644 (1980-11-01), Hwang et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4515304 (1985-05-01), Berger
patent: 4573067 (1986-02-01), Tuckerman et al.
patent: 4631636 (1986-12-01), Andrews
patent: 4646129 (1987-02-01), Yerman et al.
patent: 4700879 (1987-10-01), Weidenawer
Manko, Howard H., Solders and Soldering, 2nd Ed., p. 135, McGraw-Hill, Apr., 1980.

Affiliated with

Also associated with

Rating

Method of assembling a fluid-cooled integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembling a fluid-cooled integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembling a fluid-cooled integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2229360