Method for CMP with variable down-force adjustment

Details Method for CMP with variable down-force adjustment Method for CMP with variable down-force adjustment

2008-03-18

2008-03-18

Sarkar, Asok K. (Department: 2891)

Semiconductor device manufacturing: process

Chemical etching

C438S692000, C438S691000, C257SE21304

Reexamination Certificate

active

07344987

ABSTRACT:
The present invention relates to a method for performing chemical mechanical polishing. A high down-force step is performed. A low down-force step is performed. At least one of the down-force steps is modified, based on if one of the down-force steps exceeds an acceptable tolerance associated therewith. Other systems and methods are also disclosed.

REFERENCES:
patent: 5733177 (1998-03-01), Tsuchiya et al.
patent: 6113465 (2000-09-01), Kim et al.
patent: 6315645 (2001-11-01), Zhang et al.
patent: 6383928 (2002-05-01), Eissa
patent: 6551922 (2003-04-01), Grant et al.
patent: 6806193 (2004-10-01), Korthuis et al.
patent: 6913527 (2005-07-01), He
patent: 2002/0148997 (2002-10-01), Minamihaba et al.
patent: 2006/0211157 (2006-09-01), Smith et al.
patent: 2006/0228991 (2006-10-01), Kitajima et al.
“Introduction to Copper/Low-K Interconnects & Electromigration Fundamentals”, Alvin L.S. Loke, and Tin Tin Wee, IEEE Solid State Circuits Society, Sep. 12, 2003, 21 pgs.

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