Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent
1996-08-09
1998-01-20
Breneman, R. Bruce
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
216 89, 438693, H01L 21304, H01L 2130
Patent
active
057097550
ABSTRACT:
Using an APM solution to clean both the front and backside of a semiconductor wafer significantly reduces the residue from chemical mechanical polishing. A low residue count holds the wafer more securely to the electrostatic chuck, thus improving processing, reducing wear on the electrostatic chuck, and increasing its lifetime.
REFERENCES:
patent: 5317778 (1994-06-01), Kudo et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5441591 (1995-08-01), Imthurn et al.
patent: 5606251 (1997-02-01), Ryle et al.
"Mechanical Brush Scrubbing for Post-CMP Clean"; Krussell et al.; Solid State Tech., vol. 38, No. 6, pp. 109-114; Jun. 1995.
Chang Chung-Long
Kuo So Wein
Shih Tsu
Ackerman Stephen B.
Breneman R. Bruce
Goudreau George
Saile George O.
Taiwan Semiconductor Manufacturing Company , Ltd.
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