Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Patent
1997-04-22
1998-12-08
El-Arini, Zeinab
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
134 7, 134 32, 134 33, 134902, B08B 102, B08B 304, B08B 704
Patent
active
058463356
ABSTRACT:
A semiconductor cleaning method includes scrubbing a semiconductor wafer using a cleaning member made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores have an average diameter ranging from 10 to 200 .mu.m. The cleaning member may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. By this scrubbing step, particles that are strongly attached to the surface of a substrate such as the semiconductor wafer can easily be removed. During cleaning of the substrate, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.
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Aoki Riichiro
Kodera Masako
Kouno Gisuke
Maekawa Toshiro
Mishima Shiro
Ebara Corporation
El-Arini Zeinab
Kabushiki Kaisha Toshiba
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