Method for cleaning the surface of a substrate with plasma

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437937, 437946, B44C 122

Patent

active

052521818

ABSTRACT:
Method for cleaning, with plasma, the surface of a substrate before another treatment, consisting:

REFERENCES:
patent: 4923828 (1990-05-01), Gluck et al.
patent: 5043299 (1991-08-01), Chang et al.
Journal of Applies Physics, vol. 68, No. 9, Nov. 1, 1990, pp. 4681-4693, NY, NY; T.-R. Yew et al.: "Low-temperature in situ surface cleaning of oxide-patterned wafers by Ar/H.sub.2 plasma sputter".
Journal of Applied Physics, vol. 62, No. 10, Nov. 15, 1987, pp. 4255-4268, Woodbury, NY; W. R. Burger et al.: "An optimized in situ argon sputter cleaning process for . . . ".

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