Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-12-17
1993-10-12
Hearn, Brian E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
437937, 437946, B44C 122
Patent
active
052521818
ABSTRACT:
Method for cleaning, with plasma, the surface of a substrate before another treatment, consisting:
REFERENCES:
patent: 4923828 (1990-05-01), Gluck et al.
patent: 5043299 (1991-08-01), Chang et al.
Journal of Applies Physics, vol. 68, No. 9, Nov. 1, 1990, pp. 4681-4693, NY, NY; T.-R. Yew et al.: "Low-temperature in situ surface cleaning of oxide-patterned wafers by Ar/H.sub.2 plasma sputter".
Journal of Applied Physics, vol. 62, No. 10, Nov. 15, 1987, pp. 4255-4268, Woodbury, NY; W. R. Burger et al.: "An optimized in situ argon sputter cleaning process for . . . ".
Bensahel Daniel
Dutartre Didier
Regolini Jorge L.
Chaudhari C.
Etablissement Autonome de Droit Public: France Telecom
Hearn Brian E.
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