Method for cleaning the surface of a substrate

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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Details

C134S001300, C216S062000, C216S078000, C438S705000, C438S714000, C438S715000, C438S734000

Reexamination Certificate

active

07063091

ABSTRACT:
A cleaning process for cleaning the surface of a substrate is disclosed, wherein the surface comprises portions of a dielectric material and portions of a conductive material. According to the method disclosed, the temperature at the surface of the substrate is kept below a predefined value during the actual cleaning step in a reactive and/or inert plasma ambient, such as an argon gas ambient, wherein the predefined value corresponds to the surface temperature at which agglomeration of the conductive material occurs.

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patent: 2004/0131878 (2004-07-01), Seet et al.
patent: 2005/0054202 (2005-03-01), Pan et al.
patent: 1 081 751 (2001-03-01), None
patent: 01-258444 (1989-10-01), None

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