Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2006-06-20
2006-06-20
Goudreau, George A. (Department: 1763)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S001300, C216S062000, C216S078000, C438S705000, C438S714000, C438S715000, C438S734000
Reexamination Certificate
active
07063091
ABSTRACT:
A cleaning process for cleaning the surface of a substrate is disclosed, wherein the surface comprises portions of a dielectric material and portions of a conductive material. According to the method disclosed, the temperature at the surface of the substrate is kept below a predefined value during the actual cleaning step in a reactive and/or inert plasma ambient, such as an argon gas ambient, wherein the predefined value corresponds to the surface temperature at which agglomeration of the conductive material occurs.
REFERENCES:
patent: 5432073 (1995-07-01), Wu et al.
patent: 6107182 (2000-08-01), Asahina et al.
patent: 6110828 (2000-08-01), Guo et al.
patent: 6613660 (2003-09-01), Kahlert et al.
patent: 6764940 (2004-07-01), Rozbicki et al.
patent: 2003/0134504 (2003-07-01), Denning et al.
patent: 2004/0131878 (2004-07-01), Seet et al.
patent: 2005/0054202 (2005-03-01), Pan et al.
patent: 1 081 751 (2001-03-01), None
patent: 01-258444 (1989-10-01), None
Huebler Peter
Kahlert Volker
Koschinsky Frank
Advanced Micro Devices , Inc.
Goudreau George A.
Williams Morgan & Amerson
LandOfFree
Method for cleaning the surface of a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for cleaning the surface of a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for cleaning the surface of a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3626221