Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-11-15
1997-09-23
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566381, 134 3, 134 34, 437228ST, 437228T, 252 792, H01L 2100
Patent
active
056700164
ABSTRACT:
A method for cleaning a substrate prior to tungsten deposition is disclosed, said substrate having via holes and trenches lines thereon. The method includes steps of
REFERENCES:
patent: 5376235 (1994-12-01), Langley
"A Highly Reliable Selective . . . VLSI Contacts", by H. Kotani et al., IEDM Tech. Digest, 1987, pp. 217-220.
"High Rate Low-Temperature Selective Tungsten", by R.F. Foster et al., Yungysen Workshop III, MRS (NY, USA, 1988) pp. 69-72.
"Chemical Vapor Deposition of . . . Tungsten Silicide", by J.E.J. Schmitz, Noyes Publications, NJ, 1992 pp. 75-77.
"Selective CVD Tungsten . . . on VLSI Circuits", by Donald R. Bradbury et al., IEDM Tech. Digest, 1991, pp. 273-276.
"Handbook of Semiconductor Wafer Cleaning Technology", by Werner Kern, Noyes Publication, NJ, USA, 1993, pp. 120-124.
"Aluminum Etching in Carbon Tetrachloride Plasmas", by K. Tokunaga et al., J.Electrochem. Soc. 127, 1980 pp. 928-932.
"Comparison of Aluminum . . . Trichloride Plasmas", by K. Tokunaga et al., J.Electrochem. Soc. 128, 1981, pp. 851-855.
"Plasma Etching", by Dennis M. Manos, Academic Press., CA, USA 1989, pp. 153-155.
"Heavy Metal Contamination . . . Plasma Stripping", by S. Fujimura et al., J.Electrochem. Soc. 135, 1988 pp. 1195-1201.
"Issues with Selectively . . . Process Integration", by J.A. Sellers et al., Mat.Res.Soc. Symp.Proc. VLSI V, 1990 pp. 227-232.
"Segregation and Removal . . . and Fluorine Etchant", by Tadahiro Ohmi et al., J.Electrochem. Soc. 140 , 1993, pp. 811-817.
"Study on Adhesion . . . Perfluoroalkoxy Resin Surface", by K. Ohtani et al., J.Electrochem. Soc., 140, 1993 pp. 2244-2249.
"Generation Mechanism . . . after Ashing", by Akihiro Usujima et al., J.Electrochem. Soc., 141, 1994 pp. 2487-2493.
"Multilevel Interconnect for ASIC . . . Via Resistance" by, Thien Nguye et al., VMIC, 1994 pp. 353-355.
"An Efficient Preclean . . . Submicron Tungsten Plugs" by Wen-Kuan Yeh et al., J.Electrochem. Soc., 142, 1995 pp. 3584-3588.
Chen Mao-Chieh
Liu Lu-Min
Wang Pei-Jan
Yeh Wen-Kuan
National Science Council
Powell William
LandOfFree
Method for cleaning substrate prior to tungsten deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for cleaning substrate prior to tungsten deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for cleaning substrate prior to tungsten deposition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1937643