Method for cleaning an integrated circuit device using an aqueou

Details Method for cleaning an integrated circuit device using an aqueou Method for cleaning an integrated circuit device using an aqueou

1998-02-25

1998-07-21

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 26, 134 28, 134 29, 134 36, 134 41, 134902, 510175, 510176, 510372, 510505, C03C 1500

Patent

active

057829845

ABSTRACT:
A method for cleaning an integrated circuit substrate comprises cleaning the integrated circuit substrate by contacting the integrated circuit substrate with an aqueous cleaning composition. The aqueous cleaning composition comprises from about 0.1 to about 2 percent of hydrogen fluoride based on the volume of the composition, from about 9 to about 15 percent of hydrogen peroxide based on the volume of the composition, and from about 41 to about 47 percent of a C.sub.1 to C.sub.6 alcohol based on the volume of the composition.

REFERENCES:
patent: 3992235 (1976-11-01), Garbarini
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5250460 (1993-10-01), Yamagata et al.
patent: 5374329 (1994-12-01), Miyawaki
patent: 5670411 (1997-09-01), Yonehara et al.
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5713838 (1998-02-01), Yarborough

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