Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2008-05-06
2010-06-22
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
Reexamination Certificate
active
07741225
ABSTRACT:
A thin silicon solar cell having a back dielectric passivation and rear contact with local back surface field is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A barrier layer and a dielectric layer are applied at least to the back surface of the silicon wafer to protect the silicon wafer from deformation when the rear contact is formed. At least one opening is made to the dielectric layer. An aluminum contact that provides a back surface field is formed in the opening and on the dielectric layer. The aluminum contact may be applied by screen printing an aluminum paste having from one to 12 atomic percent silicon and then applying a heat treatment at 750 degrees Celsius.
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Meemongkolkiat Vichai
Rohatgi Ajeet
Alston & Bird LLP
Georgia Tech Research Corporation
Geyer Scott B
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