Metal working – Method of mechanical manufacture – Watch or clock making
Patent
1998-03-03
2000-01-18
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Watch or clock making
29830, 29840, H05K 302
Patent
active
060148098
ABSTRACT:
The present invention provides a method of performing high density over the edge circuitization on circuit cards. In particular, the invention allows for circuits having width and spacing requirements of one millimeter or less to be placed over the edge of a substrate. The method includes the steps of: (1) angling the substrate such that the first surface, second surface and edge separating the two surfaces form an exposed region; (2) metallically sputter seeding the exposed region from a seeding source such that a metallic sputter seed layer is formed; (3) covering the exposed region with a dielectric material; (4) ablating portions of the dielectric material; (5) applying a conductive layer, for example, with copper plating, on the circuit path to form a circuit; (6) removing the remaining unablated dielectric material, thereby exposing portions of the metallic sputter seed layer that are adjacent to the circuit; and (7) removing the exposed portions of the metallic sputter seed layer that are not part of the circuit.
REFERENCES:
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5276963 (1994-01-01), Flanders
patent: 5388024 (1995-02-01), Galvagni
patent: 5459500 (1995-10-01), Morris et al.
patent: 5562461 (1996-10-01), Obara et al.
IBM Technical Disclosure Bulletin vol. 23, No. 12, May, 1981, Edge-Mounted MLC Packaging Scheme, by Gegenwarth et al.
Arbes Carl J.
Fraley Lawrence R.
International Business Machines - Corporation
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