Method for chemically mechanically polishing organic film,...

Details Method for chemically mechanically polishing organic film,... Method for chemically mechanically polishing organic film,...

2008-07-22

2008-07-22

Vinh, Lan (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S693000, C156S345120

Reexamination Certificate

active

11418070

ABSTRACT:
There is proposed a polishing method. The method includes feeding a slurry onto a polishing pad, press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon, and chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head.

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patent: 7252782 (2007-08-01), Ikeda et al.
patent: 2002/0072195 (2002-06-01), Anma et al.
patent: 2002/0193051 (2002-12-01), Homma et al.
patent: 2004/0253822 (2004-12-01), Matsui et al.
patent: 2004/363191 (2004-12-01), None

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