Method for chemical mechanical polishing for fabricating...

Details Method for chemical mechanical polishing for fabricating... Method for chemical mechanical polishing for fabricating...

2005-10-18

2005-10-18

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

C438S054000, C438S692000, C438S693000

Reexamination Certificate

active

06955935

ABSTRACT:
Disclosure is a method for a chemical mechanical polishing process for fabricating a semiconductor device. The method for performing the chemical mechanical polishing process for a copper layer on a semiconductor wafer comprises the steps of: performing the chemical mechanical polishing process for the copper layer on the semiconductor wafer by using slurry; performing a standstill process in a middle of the chemical mechanical polishing process; and carrying out the chemical mechanical polishing process again after performing the standstill process.

REFERENCES:
patent: 6634930 (2003-10-01), Chen et al.
patent: 6733685 (2004-05-01), Beilin et al.

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