Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2011-03-29
2011-03-29
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S102000, C257SE21214, C257SE21230
Reexamination Certificate
active
07915071
ABSTRACT:
A method and associated composition for chemical mechanical planarization of a chalcogenide-containing substrate (e.g., germanium/antimony/tellurium (GST)-containing substrate) are described. The composition and method afford low defect levels (e.g., scratches incurred during polishing) as well as low dishing and local erosion levels on the chalcogenide-containing substrate during CMP processing.
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Gregory B. Shinn, et al., Chemical-Mechanical Polish, Handbook of Semiconductor Mfg.Tech, Chapter 15, 2000, pp. 415-460.
Siddiqui Junaid Ahmed
Usmani Saifi
Booker Vicki B
Chase Geoffrey L.
DuPont Air Products Nanomaterials LLC
Landau Matthew C
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