Method for chemical mechanical planarization of a metal...

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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C438S691000, C438S692000, C438S693000, C216S089000

Reexamination Certificate

active

07871931

ABSTRACT:
The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.

REFERENCES:
patent: 5457493 (1995-10-01), Leddy et al.
patent: 5506171 (1996-04-01), Leonard et al.
patent: 5620357 (1997-04-01), Misaka et al.
patent: 5638354 (1997-06-01), Nakayama et al.
patent: 6099132 (2000-08-01), Kaeriyama
patent: 6525369 (2003-02-01), Wu
patent: 6528843 (2003-03-01), Wu
patent: 6531734 (2003-03-01), Wu
patent: 6552386 (2003-04-01), Wu
patent: 6710396 (2004-03-01), Wu
patent: 6870660 (2005-03-01), DiCarlo
patent: 6962419 (2005-11-01), Huibers
patent: 7006275 (2006-02-01), Huibers
patent: 7012731 (2006-03-01), Huibers
patent: 7018052 (2006-03-01), Huibers
patent: 7023606 (2006-04-01), Huibers
patent: 7052972 (2006-05-01), Sandhu et al.
patent: 7167297 (2007-01-01), Huibers
patent: 7172296 (2007-02-01), Huibers
patent: 7196740 (2007-03-01), Huibers
patent: 7262817 (2007-08-01), Huibers
patent: 7300162 (2007-11-01), Huibers
patent: 7413962 (2008-08-01), Sandhu et al.
patent: 2003/0129782 (2003-07-01), Robbins
patent: 2004/0082275 (2004-04-01), Mahulikar et al.
patent: 2004/0125346 (2004-07-01), Huibers
patent: 2004/0160659 (2004-08-01), DiCarlo
patent: 2004/0218149 (2004-11-01), Huibers
patent: 2004/0218154 (2004-11-01), Huibers
patent: 2004/0218292 (2004-11-01), Huibers
patent: 2004/0218293 (2004-11-01), Huibers
patent: 2004/0223088 (2004-11-01), Huibers
patent: 2004/0223240 (2004-11-01), Huibers
patent: 2004/0233392 (2004-11-01), Huibers
patent: 2005/0007557 (2005-01-01), Huibers
patent: 2006/0268391 (2006-11-01), DiCarlo
patent: 2007/0285757 (2007-12-01), DiCarlo et al.

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