Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2008-06-10
2008-06-10
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
Reexamination Certificate
active
07384806
ABSTRACT:
A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.
REFERENCES:
patent: 2758502 (1956-08-01), Scott et al.
patent: 2969708 (1961-01-01), Polanyi et al.
patent: 3013467 (1961-12-01), Minsky
patent: 3049047 (1962-08-01), Polanyi et al.
patent: 3187627 (1965-06-01), Kapany
patent: 3360659 (1967-12-01), Young
patent: 3497694 (1970-02-01), Jura et al.
patent: 3602572 (1971-08-01), Norris
patent: 3705755 (1972-12-01), Baer
patent: 3719776 (1973-03-01), Fujiyasu et al.
patent: 3764512 (1973-10-01), Greenwood et al.
patent: 3775735 (1973-11-01), Funk et al.
patent: 3782823 (1974-01-01), Kantorski et al.
patent: 3790281 (1974-02-01), Kessler et al.
patent: 3813140 (1974-05-01), Knockeart
patent: 3926500 (1975-12-01), Frosch et al.
patent: 3947628 (1976-03-01), Alien et al.
patent: 3980818 (1976-09-01), Browning
patent: 4045772 (1977-08-01), Bouton et al.
patent: 4063226 (1977-12-01), Kozma et al.
patent: 4068381 (1978-01-01), Ballard et al.
patent: 4111557 (1978-09-01), Rottenkolber et al.
patent: 4125828 (1978-11-01), Resnick et al.
patent: 4141032 (1979-02-01), Haeusler
patent: 4160263 (1979-07-01), Christy et al.
patent: 4194217 (1980-03-01), van den Bosch
patent: 4198571 (1980-04-01), Sheppard
patent: 4207554 (1980-06-01), Resnick et al.
patent: 4211924 (1980-07-01), Muller et al.
patent: 4218112 (1980-08-01), Ruker
patent: 4223354 (1980-09-01), Noble et al.
patent: 4236179 (1980-11-01), Dreyfus et al.
patent: 4240692 (1980-12-01), Winston
patent: 4247203 (1981-01-01), Levy et al.
patent: 4255971 (1981-03-01), Rosencwaig
patent: 4284897 (1981-08-01), Sawamura et al.
patent: 4311358 (1982-01-01), Gibbons et al.
patent: 4314763 (1982-02-01), Steigmeier et al.
patent: 4333838 (1982-06-01), Ballnus
patent: 4342905 (1982-08-01), Fujii et al.
patent: 4343993 (1982-08-01), Binnig et al.
patent: 4347001 (1982-08-01), Levy et al.
patent: 4348263 (1982-09-01), Draper et al.
patent: 4350892 (1982-09-01), Kay et al.
patent: 4354114 (1982-10-01), Karnaukhov et al.
patent: 4362943 (1982-12-01), Presby
patent: 4366380 (1982-12-01), Mirkin
patent: 4379135 (1983-04-01), Sasaki et al.
patent: 4379231 (1983-04-01), Shii et al.
patent: 4381963 (1983-05-01), Goldstein et al.
patent: 4405237 (1983-09-01), Manuccia et al.
patent: 4406015 (1983-09-01), Koga
patent: 4406525 (1983-09-01), Itoh et al.
patent: 4407008 (1983-09-01), Schmidt et al.
patent: 4448532 (1984-05-01), Joseph et al.
patent: 4455485 (1984-06-01), Hosala et al.
patent: 4485409 (1984-11-01), Schumacher
patent: 4532650 (1985-07-01), Wihl et al.
patent: 4549204 (1985-10-01), Bertero et al.
patent: 4555798 (1985-11-01), Broadbent, Jr. et al.
patent: 4556317 (1985-12-01), Sandland et al.
patent: 4579455 (1986-04-01), Levy et al.
patent: 4604910 (1986-08-01), Chadwick et al.
patent: 4618938 (1986-10-01), Sandland et al.
patent: 4631581 (1986-12-01), Carlsson
patent: 4633504 (1986-12-01), Wihl
patent: 4636069 (1987-01-01), Balasubramanian
patent: 4639587 (1987-01-01), Chadwick et al.
patent: 4644172 (1987-02-01), Sandland et al.
patent: 4733063 (1988-03-01), Kimura et al.
patent: 4758094 (1988-07-01), Wihl et al.
patent: 4786170 (1988-11-01), Groebler
patent: 4805123 (1989-02-01), Specht et al.
patent: 4818110 (1989-04-01), Davidson
patent: 4827125 (1989-05-01), Goldstein
patent: 4844617 (1989-07-01), Kelderman et al.
patent: 4845373 (1989-07-01), Jamieson et al.
patent: 4845558 (1989-07-01), Tsai et al.
patent: 4863226 (1989-09-01), Houpt et al.
patent: 4863252 (1989-09-01), McCarthy et al.
patent: 4877326 (1989-10-01), Chadwick et al.
patent: 4926489 (1990-05-01), Danielson et al.
patent: 4957367 (1990-09-01), Dulman
patent: 5030008 (1991-07-01), Scott et al.
patent: 5032735 (1991-07-01), Kobayashi et al.
patent: 5034613 (1991-07-01), Denk et al.
patent: 5035476 (1991-07-01), Ellis et al.
patent: 5046847 (1991-09-01), Nakata et al.
patent: 5084612 (1992-01-01), Iwasaki et al.
patent: 5091320 (1992-02-01), Aspnes et al.
patent: 5091652 (1992-02-01), Mathies et al.
patent: 5112129 (1992-05-01), Davidson et al.
patent: 5117466 (1992-05-01), Buican et al.
patent: 5122648 (1992-06-01), Cohen et al.
patent: 5122653 (1992-06-01), Ohki
patent: 5127726 (1992-07-01), Moran
patent: 5127730 (1992-07-01), Brelje et al.
patent: 5129010 (1992-07-01), Higuchi et al.
patent: 5153428 (1992-10-01), Ellis
patent: 5162641 (1992-11-01), Fountain
patent: 5185645 (1993-02-01), Sartorius et al.
patent: RE34214 (1993-04-01), Carlson et al.
patent: 5243406 (1993-09-01), Ando et al.
patent: 5280452 (1994-01-01), Dhong et al.
patent: 5280542 (1994-01-01), Ozeki et al.
patent: 5289267 (1994-02-01), Busch et al.
patent: 5306902 (1994-04-01), Goodman
patent: 5355212 (1994-10-01), Wells et al.
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5438417 (1995-08-01), Busch et al.
patent: 5438418 (1995-08-01), Fukui et al.
patent: 5448364 (1995-09-01), Moran
patent: 5465145 (1995-11-01), Nakashiget et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5483055 (1996-01-01), Thompson et al.
patent: 5502306 (1996-03-01), Meisburger et al.
patent: H1530 (1996-05-01), Lee
patent: 5537669 (1996-07-01), Evans et al.
patent: 5563702 (1996-10-01), Emery et al.
patent: 5572598 (1996-11-01), Wihl et al.
patent: 5578821 (1996-11-01), Meisberger et al.
patent: 5583632 (1996-12-01), Haga
patent: 5621532 (1997-04-01), Ooki et al.
patent: 5627646 (1997-05-01), Stewart et al.
patent: 5671056 (1997-09-01), Sato
patent: 5680207 (1997-10-01), Hagiwara
patent: 5923430 (1999-07-01), Worster et al.
patent: 6753253 (2004-06-01), Takahashi et al.
patent: 7098055 (2006-08-01), Noguchi et al.
patent: 2002/0137096 (2002-09-01), Fodor et al.
patent: 2003/0203520 (2003-10-01), Worster et al.
patent: 1 232 367 (1967-01-01), None
patent: 1232367 (1967-01-01), None
patent: 2360197 (1975-06-01), None
patent: 26 55 525 (1978-06-01), None
patent: 2655525 (1978-06-01), None
patent: 3243890 (1983-06-01), None
patent: 0 052 892 (1982-06-01), None
patent: 0052892 (1982-06-01), None
patent: 0 112 401 (1984-07-01), None
patent: 0112401 (1984-07-01), None
patent: 0155247 (1985-09-01), None
patent: 487318 (1938-06-01), None
patent: 1185839 (1970-03-01), None
patent: 2 132 852 (1984-07-01), None
patent: 2132852 (1984-07-01), None
patent: 2 152 697 (1985-08-01), None
patent: 2152697 (1985-08-01), None
patent: 2 184 321 (1987-06-01), None
patent: 2184321 (1987-06-01), None
patent: WO 79/01027 (1979-11-01), None
“Integration of Automated Defect Classification Into Integrated Circuit Manufacturing,” Louis Breaux, James Kawski and Baljit Singh, IEEE/SEMI Advanced Semiconductor Manufacturing Conference (1994) pp. 290-292.
“Knightline”, Knightline Technology, Inc. Winter 1995, 6 pages.
“Knightline”, Knights Technology, Inc., Spring 1996 (4 pages).
“Merlin's Framework”, Knignts Technology, Inc., Jul. 1997 (4 pages).
“Principles of Optics,” Pergamon Press, Lindon (1959) p. 417(f).
“Techniques for Syntactic Analysis of Images with Application for Automatic Visual Inspection”, Youling Lin, M.S., A Dissertation in Business Administration, Dec. 1990.
“The Engineering Index Annual,” (1983) pp. 3434 and 4491.
“The Yield Manager System”, Knig
Lee Ken K.
Worster Bruce W.
Davis , Wright, Tremaine, LLP
Kla-Tencor Corporation
Lebentritt Michael
Stevenson Andrel
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