Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-05-13
2008-05-13
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C414S805000, C438S800000, C257SE21159
Reexamination Certificate
active
10529171
ABSTRACT:
A method for carrying an object to be processed used for a processing apparatus which comprises a plurality of process chambers including a specific process chamber for a process in which the object in process is easily contaminated and a carrying mechanism having two picks. The method includes a plurality of carrying steps wherein the object in process is sequentially carried from one chamber to another among the plurality of process chambers. One of the two picks is used in carrying steps up right before carrying the object into the specific process chamber, and the other pick is used in the step of carrying the object into the specific process chamber and the later carrying steps.
REFERENCES:
patent: 5932014 (1999-08-01), Hayashi et al.
patent: 6602793 (2003-08-01), Masterson
patent: 2002/0159864 (2002-10-01), Lowrance
patent: 1 152 456 (2001-11-01), None
patent: 05-021579 (1993-01-01), None
patent: 10-150090 (1998-06-01), None
patent: 11-026548 (1999-01-01), None
Horike Eiji
Ishizawa Shigeru
Lebentritt Michael
Patel Reema
Tokyo Electron Limited
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