Method for carbon film production

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20419225, 20419226, 20419228, C23C 1434

Patent

active

050732412

ABSTRACT:
A carbon film producing method utilizing a reactive sputtering process for projecting carbon particles from a graphite target electrode to deposite a very thin layer on a substrate. The reactive sputtering process is performed at a predetermined pressure in an atmosphere of hydrogen gas mixed at a predetermined ratio to another kind of gas.

REFERENCES:
patent: 3840451 (1974-10-01), Golyanov et al.
patent: 4365015 (1982-12-01), Kitajima et al.
patent: 4414085 (1983-11-01), Wickersham et al.
patent: 4486286 (1984-12-01), Levin et al.
patent: 4597844 (1986-07-01), Hiraki et al.
McKenzie et al., "Hydrogenated . . . mixtures", Applied Optics, Oct. 1982, vol. 21, No. 20, pp. 3615-3617.
Hiraki et al., "Tetrahedral . . . Substrate", Solid State Communications, vol. 50, No. 8, pp. 713-716, 1984.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for carbon film production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for carbon film production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for carbon film production will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-833792

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.