Method for burying resist and method for manufacturing...

Details Method for burying resist and method for manufacturing... Method for burying resist and method for manufacturing...

2007-12-25

2007-12-25

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S313000, C438S690000

Reexamination Certificate

active

10676090

ABSTRACT:
A resist film is applied to an entire surface and subjected to patterning substantially in the same form as an opening to bury the resist film inside the opening. When a positive resist is used, a photomask having a light-shielding portion with an area smaller than the opening is used in patterning. When a negative resist is used, a photomask having a light transmitting portion with an area smaller than the opening is used.

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patent: 6100177 (2000-08-01), Noguchi
patent: 6146968 (2000-11-01), Lu et al.
patent: 6287955 (2001-09-01), Wang et al.
patent: 6645851 (2003-11-01), Ho et al.
patent: 1009687 (1987-03-01), None
patent: 8-204150 (1996-08-01), None
patent: 9-321046 (1997-12-01), None

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