Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-10-31
1999-09-21
Picardat, KEvin M.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438612, 438613, H01L 2144
Patent
active
059566060
ABSTRACT:
An electrical interconnect structure, including a first component (300), a second component (320), and an electrical interconnect electrically and mechanically interconnecting the first component to the second component, the electrical interconnect including a first solder sphere (314) and a second solder sphere (318) stacked on each other. A semiconductor die (200, 100) that is bumped and packaged utilizing the electrical interconnect structure is also disclosed.
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patent: 5726079 (1998-03-01), Johnson
Marie S. Cole et al., "A Review of Available Ball Grid Array (BGA) Packages", published by SMTA, Edina, MN, 1995, pp. 207-213.
Donald R. Banks et al., "Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array", 3rd International Exposition on Multichip Modules, Apr. 13-15, 1994, Rev. Oct. 10, 1994, pp. 53-57.
Donald R. Banks et al, "Assembly and Reliability of Ceramic Column Grid Array", published by SMTA,Edina, MN, 1995, pp. 271-276.
Andrea Lawrence et al., "High Volumn Assembly of Ceramic Column Grid Array (CCGA)", published by SMTA, Edina, MN, 1995, pp. 116-122.
Collins Deven
Motorola Inc.
Picardat Kevin M.
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