Method for bonding IC chips to substrates incorporating...

Details Method for bonding IC chips to substrates incorporating... Method for bonding IC chips to substrates incorporating...

2007-11-27

2007-11-27

Luu, Chuong Anh (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S118000, C438S613000

Reexamination Certificate

active

11183590

ABSTRACT:
An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

REFERENCES:
patent: 5523628 (1996-06-01), Williams et al.
patent: 5734199 (1998-03-01), Kawakita et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6724084 (2004-04-01), Hikita et al.
patent: 6963385 (2005-11-01), Aruga et al.

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