Method for bonding IC chips to substrates incorporating...

Details Method for bonding IC chips to substrates incorporating... Method for bonding IC chips to substrates incorporating...

2005-07-19

2005-07-19

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

Reexamination Certificate

active

06919642

ABSTRACT:
An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.

REFERENCES:
patent: 5523628 (1996-06-01), Williams et al.
patent: 5734199 (1998-03-01), Kawakita et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6724084 (2004-04-01), Hikita et al.

Affiliated with

Also associated with

Rating

Method for bonding IC chips to substrates incorporating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for bonding IC chips to substrates incorporating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for bonding IC chips to substrates incorporating... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3423654