Method for blocking dislocation propagation of semiconductor

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

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C438S029000, C438S046000, C438S082000, C438S478000, C438S483000, C257SE21125, C257SE21158, C257SE21318

Reexamination Certificate

active

07943494

ABSTRACT:
The present invention provides a method for blocking the dislocation propagation of a semiconductor. A semiconductor layer is formed by epitaxial process on a substrate. A plurality of recesses is formed on the semiconductor layer by etching fragile locations of the semiconductor layer where dislocation occurs. Thereafter, a blocking layer is formed on each of the plurality of recesses. The aforesaid semiconductor layer undergoes epitaxial process again on the aforesaid semiconductor layer, and laterally overgrows to redirect the dislocation defects.

REFERENCES:
patent: 2004/0067648 (2004-04-01), Morita et al.
patent: 2006/0035447 (2006-02-01), Ikeda et al.
patent: 2009/0294860 (2009-12-01), Mowry et al.
patent: 561632 (2003-11-01), None
patent: 242898 (2005-11-01), None
Bell et al. Light Emission and Microstructure of Mg-doped AIGaN grown on Patterned sapphire, Jan. 20, 2003, Applied Physics Letters, vol. 82, No. 3.
Shuji et al. InGaN/GaN/AIGaN-based laser diodes with modulation-doped strained-layer superlattices grown on an epitaxially laterally overgrown GaN substrate, Jan. 12, 1998, AppLied Physics Letter. 72 (2).

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