Method for avoiding short-circuit of conductive wires

Details Method for avoiding short-circuit of conductive wires Method for avoiding short-circuit of conductive wires

2006-04-18

2006-04-18

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07030011

ABSTRACT:
A method for avoiding short circuits between conductive wires. The method includes providing a substrate having a contact area, forming a first opening in the substrate to expose the contact area, filling the first opening with a first conductive material to form a first conductive layer, removing a portion of the first conductive layer to form a second opening, in order to expose a sidewall of the substrate, forming a spacer on the sidewall, depositing a poly-silicon layer over the substrate to fill the second opening to form a second conductive layer, etching back the poly-silicon layer to expose a portion of the spacer, forming a patterned dielectric layer over the substrate to define a wire opening in order to expose the second conductive layer, and filling the wire opening with a third conductive material to form a wire electrically connected with the second conductive layer.

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